What is a Hybrid Memory Cube (HMC)?

What is a Hybrid Memory Cube (HMC)?

The Hybrid Memory Cube (HMC) is the high-performance RAM interface through-silicon via (TSV) technology by connecting the multiple memory arrays to the top of one another. It uses standard DRAM cells for memory implementation.

What is the market value of HMC and HBM by 2029?

Therefore, the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market value would rocket up to USD 16.86 billion by 2029. The hybrid memory cube (HMC) and high-bandwidth memory (HBM) are high performance RAM (Random Access Memory) interfaces that are stacked in DRAM memory.

What is the difference between HMC and HBM?

The hybrid memory cube (HMC) and high-bandwidth memory (HBM) are high performance RAM (Random Access Memory) interfaces that are stacked in DRAM memory. The hybrid memory cube (HMC) and high-bandwidth memory (HBM) interfaces improve the memory performance and are therefore used by world’s greatest giants.

What is the forecast period of HMC and HBM market research report?

Data Bridge Market Research analyses that the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market will exhibit a CAGR of 29.88% for the forecast period of 2022-2029. Therefore, the hybrid memory cube (HMC) and high-bandwidth memory (HBM) market value would rocket up to USD 16.86 billion by 2029.